» 支持 LGA1700 Intel® 第 12/13 代 Desktop CPU（TDP 高达 65W）
» 双通道 DDR5 内存，频率高达 4400MHz
» 支持 DisplayPort 1.2、HDMI™ 和 eDP
» 支持 PCIe Gen5 / Gen4 /Gen3 信号
Specifications
IEI's COM-HPC Client Size C:
Compact Powerhouse for High-Demand Industrial Applications
As industries demand more computing power in smaller devices, single units are now expected to handle a wide range of tasks comprehensively, even in industrial applications.
IEI introduces the COM-HPC Client Size C module, featuring a 14th Gen Intel® Core™ processor with up to 24 cores, PCIe Gen5 lanes, and quadruple 4K displays. Optimized for demanding applications, it supports AI, industrial automation, and more, ensuring reliability with advanced features.
14th GEN high
performance CPU+GPU
PCIe Gen5
high bandwidth
4 simultaneous
displays
Extensive connectivity
with USB 3.2 GEN2,
MIPI CSI, etc.
Dual Channel DDR5 SODIMM 5600MHz up to 96GB
12 PCIe Expansion:
1 PCIe x16 (Gen5),
4 PCIe x4 (Gen4),
1 PCIe x4 (Gen3),
6 PCIe x1 (Gen3)
Unleashing Power with Intel’s 14th Gen i9
The HUK-CR680 supports the cutting-edge Intel® 14th Generation i9-14900 processor, marking a significant leap forward in computing power and efficiency. This integration signifies up to a 2.23 times performance boost over systems with Intel® 11th Generation processors, showcasing the rapid advancement in processor technology in recent generations.
The Raptor Lake-S Refresh processors benefit from Intel®'s hybrid design, which combines Performance-cores with Efficient-cores. Equipped with these high-performance processors, this system excels in several key domains, including high-performance edge computing, data analytics, artificial intelligence (AI), and machine learning (ML). This hybrid architecture ensures optimal performance and efficiency, making it an ideal choice for demanding applications and workloads.
| Processor | P-cores/E-cores Max Frequency | EUs | TDP |
| Intel® Core™ i9 processor 14900 | 5.4GHz/4.3GHz | 32 | 65W |
| Intel® Core™ i7 processor 14700 | 5.3GHz/4.2GHz | 32 | 65W |
| Intel® Core™ i5 processor 14400 | 4.7GHz/3.5GHz | 24 | 65W |
| Intel® Core™ i3 processor 14100 | 4.7GHz/n.a. | 24 | 60W |
Quad Independent Displays
The HUK-R680, integrated with Intel® UHD graphics 730/770 driven by Xe architecture, supports four independent displays, enabling a multi-monitor setup that enhances productivity and multitasking. With three DDI and one eDP interfaces up to 4kp60 resolution, it allows for flexible video interface design.
3 x DDI Interfaces
1 x eDP Interface
4K Capable
Up To 32EUs
Future-Proof PCIe Gen 5 Expansion
The growth of AI, data centers, and high-performance computing drives the adoption of PCIe 5.0, which offers significantly higher data throughput and transmission speeds. Each new PCIe standard iteration aims to double the transmission speed, enhancing efficiency and capability in managing large data volumes. This trend underscores the continuous push for better performance in data-intensive applications.
Carrier Board Design Service
IEI offers a fast, cost-effective carrier board design service that minimizes time to market. Our experienced R&D teams assist from initial design to prototype testing, offering reference schematics, review services, and simulation for confidence in design functionality. Our Shanghai and Taipei labs provide advanced signal and power sequence verification to ensure reliability and resolve design-application barriers.
COM-HPC: Revolutionizing High-Performance Computing with Enhanced Processing Power, Energy Efficiency, and Connectivity
COM-HPC, short for Computer-on-Module for High-Performance Computing, represents a significant leap forward in terms of processing power, energy efficiency, and connectivity. It promises to supercharge data-intensive applications, enable real-time analytics, and drive innovation across various sectors, including autonomous vehicles, AI-driven solutions, healthcare, and more.
Unleash the Power of Size C COM-HPC Module
Designed for high-performance applications, our Client Type Size C module is the perfect blend of power, scalability, and efficiency.
- Maximum I/O Density and Performance
- High-Performance Processors
- Strong Future Scalability
- Enhanced Thermal Management
| COM-HPC Size | Benefits |
| Mini | Smallest size, suitable for ultra-compact systems; minimal power consumption, simple thermal management. |
| Size A | Small size, suitable for space-constrained applications; low power consumption, easy thermal management. |
| Size B | Medium size, provides more I/O interfaces; suitable for embedded and medium-performance applications. |
| Size C | Provides maximum I/O density and performance; supports high-performance processors and more interfaces; strong future scalability. |
| Size D | Larger size, suitable for applications requiring extensive I/O and high bandwidth; supports higher thermal design power. |
| Size E | Largest size, offers the most comprehensive I/O and highest performance; suitable for the most demanding high-performance computing needs. |
Enhanced Performance
Handle complex workloads, process large
datasets in real-time, and accelerate
time-to-insight
Scalability and Flexibility
Future-proof investments and easily upgrade
computing capabilities without significant
hardware changes
Energy Efficiency
Consuming less power while delivering
high-performance computing capabilities
Robotic Surgery
Rugged Network Communication
Test and Measurement
Real-time collaborative robotics
Hardware Spec.
| 尺寸类型 | |
|---|---|
| 尺寸类型 | COM-HPC SIZE C |
| 系统 | |
| CPU | Intel® Alder Lake-S/Raptor Lake-S/Raptor Lake-S Refresh LGA1700 Desktop CPU (TDP up to 65W) |
| 芯片组 | R680E |
| 内存 | 2 x 262pin DDR5 5600 SO-DIMM sockets |
| 内存上限 | 高达 96GB |
| 散热方案/系统风扇 | 1 x CPU 风扇接口 |
| 物理特性 | |
| 尺寸 (LxWxH) (mm) | 160 x 120mm |
| 存储 | |
| 存储 | 2 x SATA : 信号至底板 |
| I/O 接口 | |
| 显示输出 | 4 x Display Port : 3 x DDI 和 1 x eDP 信号至底板 |
| 网络 |
2 x LAN - 1 x Intel i226-V 2.5 GbE 网络信号至底板 1 x Intel i226-LM 2.5 GbE 网络信号至底板 |
| 音频 |
2 x HD Audio - 1 x HD 音频信号至底板 1 x 声线音频 / I2S 音频信号至底板 |
| I/O接口 | 8 x 内部 USB 2.0 : 信号至底板 |
| 4 x 外部 USB 3.2 Gen2x1 : 信号至底板 | |
| 2 x UART : 信号至底板 | |
| 扩展 | 1 x PCIe x16 : PCIe 信号至底板 |
| 5 x PCIe x4 : PCIe 信号至底板 | |
| 6 x PCIe x1 : PCIe 信号至底板 | |
| 电源 | |
| 电源供电 | |
| 环境 | |
| 操作温度 | |
| 存储温度 | |
Ordering Information
| HUK-CR680-R10 | COM-HPC Client size C Module,Intel® Alder Lake S support R680E processor, Dual 2.5 GbE, PCIe Gen 5 , SATA 6Gb/s, USB 3.2 gen 2 , RoHS |
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Package Contents
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